3D SMD

Pick and Place – Camera Test

By: Kevin Ruelas (Electronics) Using the interface definitions defined in the camera document. I was able to test the camera to make sure it worked and was taking a photo correctly. The microSD board was a big part of this test as it was required to test the image before figuring out how to send […]

Pick and Place – Z-Axis and Nozzle Test

By: Tiler Jones (Manufacturing) and Chastin Realubit (MST) Z-Axis Motor: We did an experiment to see the load that the Z-Axis can handle and we found that it will still carry up to 2000 g. This experiment was done so that we can see if the motor can still move up and down even with […]

Pick and Place – Solenoid Valve Design and Control

By: Tyler Jones (Manufacturing) and Kevin Ruelas (Electronics) The above Figure 1 and Figure 2 schematics show the solenoid circuit simulated in LTSpice. The circuit on the left shows that when the arduino pin is set to high the circuit turns on allowing the current to flow through drain and source to the solenoid valve. […]

Pick and Place – Updated Requirements and Mass Reports

By: Chastin Realubit (Missions Systems and Testing) Level 2 Requirements: L2-1: Attached compartments shall not interfere with the functionality of the machine. L2-1a: Wires shall be shielded or incorporate heat shrinks in all areas of the pick and place machine. L2-1b: The RJ-25 cables shall be able to reach every operable part of the aluminum […]

Pick and Place – Servo Driver

By: Kevin Ruelas (Electronics) The system block diagram presented in the PDR is undergoing changes, especially regarding the additional servos. The system block diagram that was made currently has two micro controllers connected via I2C. Both utilize the Me UNO shield and one port could generally house two servos. Using a 12-bit PWM/Servo Driver we […]

Pick and Place – Trade Off Study – Camera System

By: Kevin Ruelas (Electronics and Control) Due to the use of a servo driver to control the existing and additional servos, a separate Arduino can be used to house an independent camera system. This Arduino will have its own code as well as utilize visual software for edge detection.   It was important to choose […]

Pick and Place-Preliminary Project Plan

Belinda Vivas (Project Manager) Chastin Realubit (Mission, Systems, and Test) Kevin Ruelas (Electronics and Control) Tyler Jones (Manufacturing) Work Breakdown Structure By Belinda Vivas (Project Manager) and Chastin Realubit (Mission, Systems, and Test) The Work Breakdown Structure (WBS) is a summarized visual representation of the divided work between the three divisions (Systems, Electronics, and Manufacturing) […]

Pick and Place – Preliminary Design Document

Belinda Vivas (Project Manager) Amber Scardina (Mission, Systems, and Test) Kevin Ruelas (Electronics and Control) Tyler Jones (Manufacturing) Chastin Realubit (Manufacturing)     Program Objective/Mission Profile By: Belinda Vivas (Project Manager) Objective The second generation of the Pick and Place will create a 3-Dot 454 PC Board. It will ensure precision through the addition of […]

Spring 2016 3D SMD: Final Documentation

Executive Summary By Bao Loc Doan (Project Manager) Program Objective When humans manually pick up and place down surface mount components onto a printed circuit board (PCB), there are normally problems with efficiency. A surface mount component may be placed at the wrong spot or dropped. These mistakes cost the user money as well as […]

Spring 2016 3D SMD: Verification Test — Working Area

By Christine Vu (Missions, Systems, and Test) and Henry Nguyen (Electronics and Control) Working Area Test Working area is defined by the area that includes  PCB to assemble, reel feeders, and IC tray. To verify that our design meets the size criteria for working area, a test will be conducted to calculate its parameters. Requirements […]